Raw materials of thermosetting resin
Fluorene-based Epoxy resin
Fluorene-based Epoxy resins have a three-dimensional, bulky cardo structure.
It has unique properties such as combining heat resistance with transparency, or heat resistance with flexibility.
Features
High heat resistance
Low elastic modulus at high temperatures
Applications
Adhesives for electronic materials
Solid or liquid sealant raw materials
Paint raw materials
Laminated impregnated resin
（PCB, PWB, CCL, etc.）
Product list
| Product name | OGSOL PG-100 |
OGSOL CG-500 |
OGSOL EG-200 |
OGSOL EG-280 |
|---|---|---|---|---|
| Features | High heat resistance High transparency Low elastic modulus at high temperatures |
High heat resistance Good solubillity Low elastic modulus at high temperatures |
High heat resistance High adhesive stength Low elastic modulus at high temperatures |
High heat resistance High flexibillity |
| Apppearance | White powder | Yellow powder | Viscous powder | Light yelow liquid |
| Epoxy equivalents［g/eq］ | 260 | 310 | 290 | 460 |
| Total chlorine［ppm］ | 1,200 | 1,000 | 490 | 170 |
| Viscosity［mPa･s］ | 350 （150℃） |
3,200 （180℃） |
60 （150℃） |
7,500 （25℃） |
| Heat resistance (5％weight reduction temperture)［℃］ |
354 | 400 | 389 | 368 |
* Values above are for references only, not guaranteed for the products.
Elastic modulus by each temperature(PG-100,CG-500,EG-200)
Fluorene epoxy resins maintain a high modulus of elasticity at room temperature, but the modulus drops significantly at high temperatures above Tg. As a result, it is expected that warping will be reduced when processed at high temperatures.
Conditions for preparing curing product
Curing condition：175℃,5hours
Curing agent：Phenol Novolac
Curing catalyst：TPP(Triphenylphosphine)
Thermal deterioration test(EG-280)
Phenolic cured product of OGSOL EG-280 maintains its flexibility even after heat testing, compared to general-purpose flexible epoxy resins.
Conditions for preparing curing product
Curing condition：115℃,5hours
Curing agent：Phenol Novolac
Curing catalyst：TPP(Triphenylphosphine)
※For detailed data, refer to the catalog on the right.
