Photo patterning materials
Structure
Features
Photoreactive
High refractive index
High heat resistance
Low dielectric constant
Application Example
Resist
Patterning
Coating
Physical Properties Table
| OGSOL SI-20-10 |
OGSOL SI-20-14 |
||
|---|---|---|---|
| Molecular weight * GPC |
Mn | 900 | 1,000 |
| Mw | 1,200 | 1,100 | |
| Heat resistance (5% weight reduction) |
℃ | 347 | 323 |
| Refractive index | ー | 1.64 | 1.72 |
Solvent solubility
Assessment Condition: Solubility to each solvent was assessed using a shaker at room temperature.
Evaluation medthod: 10wt% solution was obtained at 1 hour( ○ ) or not( × ).
| Ethers | Aromatic series | Ester | Ketones | Alcohol | ||||
|---|---|---|---|---|---|---|---|---|
| THF | Toluene | PGMEA | Cyclohexanone | MEK | MIBK | i-Propanol | PGME | |
| OGSOL SI-20-10 |
○ | ○ | ○ | ○ | ○ | × | × | ○ |
| OGSOL SI-20-14 |
○ | ○ | ○ | ○ | ○ | × | × | × |
Resist image diagram
The SI-20 which was dissolved in a solvent is applied, it is possible to be developed after being exposed, the pattern can be produced.
