Photoreactive materials
Structure
Features
Photoreactive
High refractive index
High heat resistance
Resin modifier
Application Example
Coating
Photoreactive
Patterning
Physical Properties Table
| OGSOL SI-10-10 | OGSOL SI-10-20 | ||
|---|---|---|---|
| Molecular weight | Mn | 2,100 | 1,100 |
| Mw | 12,700 | 1,800 | |
| Heat resistance (5% weight reduction) |
℃ | 362 | 350 |
| Refractive index(589nm) | ー | 1.67 | 1.68 |
Solvent solubility
Assessment Condition: Solubility to each solvent was assessed using a shaker at room temperature.
Evaluation medthod: 10wt% solution was obtained at 1 hour( ○ ) or not( × ).
| Ethers | Aromatic series | Ester | Ketones | Alcohol | ||||
|---|---|---|---|---|---|---|---|---|
| THF | Toluene | PGMEA | Cyclohexanone | MEK | MIBK | i-Propanol | PGME | |
| OGSOL SI-10-10 |
○ | ○ | ○ | ○ | ○ | ○ | × | × |
| OGSOL SI-10-20 |
○ | ○ | ○ | ○ | ○ | × | × | × |
Absorption Spectrum Change by Ultraviolate Irradiation
The Si-Si bonds are cut off at 192 mJ/cm2, and enables patterning.
(Absorption spectrum of Si-Si bonds: 340nm)
