Thermosetting grade OGSOL SI-20 series

This series is a network type polysilane that has a silanol group (Si-OH) at the end. When heated, this polysilane is cured, making crosslinks with other reactive compounds such as epoxy. It is possible to suppress changes in the film thickness. In addition, even when cured films are heated, they do not show very much coloration and maintain a high transparency.

Basic structure Polymer with the compounds shown below as the basic structure             Polyphenylcillin   Polyalkylcillin

Polyalkylcillin     Polysilane : SI-20-12 Epoxy resin : Cresol novolak epoxy resin (ECN) Coating solution : Solid content : Weight ratio 1:1, 40 wt% cellosolve acetate solution Curing condition : 80℃ 1hr → (Temperature rise 45 min) →200℃ 1hr

Example of usage Transparent coating for LCD Semiconductor coating material

Physical properties of cured film made from polysilane and epoxy resin   Polysilane / epoxy resin (For reference)∗ Acid anhydride / epoxy resin Dielectric properties (100 MHz) Relative dielectric constant 2.9 3.6 Dielectric loss tangent 0.02 0.04 Glass transition temperature (TMA) 180 97 Refractive index (D line) 1.64 1.61 Contact angle (°) 87 70 Heat resistance (℃) 5% thermal reduction temperature 342 337 10% thermal reduction temperature 380 359 20% thermal reduction temperature 458 382 ∗Acid anhydride : Methyl tetrahydro phthalic anhydride (MTHPA)

Physical properties (representative properties)

Thermosetting reaction of polysilane and epoxy resin