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Fine chemical materials

Photoreactive materials

Structure

OGSOL SI-10-10/SI-10-20 Structure

Features

Photoreactive

High refractive index

High heat resistance

Resin modifier

Application Example

Coating

Photoreactive

Patterning

Physical Properties Table

  OGSOL SI-10-10 OGSOL SI-10-20
Molecular weight Mn 2,100 1,100
Mw 12,700 1,800
Heat resistance
(5% weight reduction)
362 350
Refractive index(589nm) 1.67 1.68

Solvent solubility

Assessment Condition: Solubility to each solvent was assessed using a shaker at room temperature.

Evaluation medthod: 10wt% solution was obtained at 1 hour( ○ ) or not( × ).

Ethers Aromatic series Ester Ketones Alcohol
THF Toluene PGMEA Cyclohexanone MEK MIBK i-Propanol PGME
OGSOL
SI-10-10
× ×
OGSOL
SI-10-20
× × ×

Absorption Spectrum Change by Ultraviolate Irradiation

The Si-Si bonds are cut off at 192 mJ/cm2, and enables patterning.
(Absorption spectrum of Si-Si bonds: 340nm)

Absorption Spectrum Change by Ultraviolate Irradiation