OGSOL epoxy resin--Fluorene derivatives--Fine materials business/Osaka Gas Chemicals Co., Ltd.

This epoxy resin has a hard fluorene structure. With the special culled structure (hinged), properties previously unavailable with conventional resin can be anticipated.

Features

High heat resistance (high Tg)
Thermal stability (5% weight loss temperature)
High refractive index

Transparency
Chemical resistance
Dispersibility
Low elasticity at high temperature

Example of usage

Various sealants
Laminated board material
Adhesive for electronics materials
Optics materials
Resist materials, etc.

Physical properties (isolated epoxy resin)

Grade		Heat resistance grade		Standard, liquid grade	(For reference)
Advantages		High Tg, high elasticity, high refractive index		High refractive index, adhesiveness, flexibility (low elasticity)	-
Product name		PG-100	CG-500 (developed part)	EG-200	BisA epoxy
Appearance (color)	-	Solid (white)	Solid (yellow)	Viscous solid (clear pale yellow)	Liquid
Epoxy equivalent weight	g/ep	259	311	292	190
Total chlorine	ppm	1,200	1,230	490	1,730
Viscosity	mPa・s	350 （150℃）	3,200 （180℃）	57 （150℃）	1,400 （25℃）
Softening point	℃	92	140	-	-
refractive index	-	1.64	1.70	1.62	1.57
Heat resistance (5% weight reduction)	℃	354	400	389	297

* The data shown in the table is for reference only. Listed values are not intended to provide any guarantee for products.

Cured physical properties (Curing agent: Novolac Phenolic, Curing medium: TPP, Curing conditions: 175°Cx5h)

Grade		Heat resistance grade		Standard, liquid grade	(For reference)
Advantages		High Tg, high elasticity, high refractive index		High refractive index, adhesiveness, flexibility (low elasticity)	-
Product name		PG-100	CG-500 (developed part)	EG-200	BisA epoxy
Tg（DMA）	℃	181	217	132	135
Flexural modulus (25℃)	MPa	3,250	3,540	3,000	2,910
Flexural modulus（260℃）	MPa	14	10	17	35
Linear expansion coefficient α1	ppm	67	68	77	68
Copper peel test	Ν	0.91	1.24	1.19	1.14
Dielectric constant	εγ	3.9	3.9	4.0	3.9
Dielectric tangent	tanδ	0.019	0.014	0.030	0.027

* The data shown in the table is for reference only. Listed values are not intended to provide any guarantee for products.

Thermal weight loss measurement (TG)

The decomposition temperature of fluorene-based epoxy is high, providing the material with an extremely high thermal stability.

* Isolated data for epoxy resin
(before curing)

Developed product: Super-low elasticity epoxy

This tough epoxy resin has an extremely high flexibility, and when twisted restores its shape without breaking. Although flexible, this resin has a high refractive index and low outgassing characteristics. It is suitable for applications requiring a certain degree of flexibility such as adhesives and sealants.

Developed resin + Novolac Phenolic curing agent