Fluorene derivatives, optical plastic / Fine Materials Business

OGSOL epoxy resin : For Thermosetting resin

The basic structure of OGSOL epoxy resin is bisaryl fluorene. This resin contains a lot of aromatic rings, with advantages such as high heat resistance, high refractive index, high transparency, and low cure shrinkage.

Advantages

  • High refractive index
  • High transparency
  • Low cure shrinkage
  • High chemical resistance
  • Heat resistance
    (high Tg, low thermal expansion)
  • Low birefringence
  • Nonflammability
  • Dispersibility

Example of usage

  • Transparent plastic substrate with high heat resistance (glass substrate substitutes)
  • High refractive index coating materials and adhesives
  • Hard coating material for touch screens
  • Semiconductor encapsulant (transparent encapsulant, die bonding sheet etc.)
  • Printed circuit board materials
  • Photoresist materials etc.
Cured OGSOL EG-210 object (film thickness : about 1 to 2 mm) Image
Cured OGSOL EG-210 object (film thickness : about 1 to 2 mm)
Transparency is high enough for us to clearly see the characters behind the resin.

Physical properties (resin)

Product name OGSOL
PG		 OGSOL
PG-100		 OGSOL
EG		 OGSOL EG-210
(Newly developed product)		 (For reference)
Bis A epoxy		 Measurement
Method
Advantages High refractive index,
high heat resistance		 High refractive index, flexibility — —
Appearance (color) Crystalline solid
(white)		 Solid
(white)		 Viscous liquid
(light yellow)		 Viscous solid
(light yellow)		 Liquid (transparent) Visual inspection
Epoxy equivalence g/eq 231 259 294 342 190 Titration method
Total chlorine ppm 1,222 1,202 896 552 1,732 Combustion method
Hydrolysis chlorine ppm 847 157 609 101 285 Titration method
Melt viscosity mPa · s 67∗1 349 59 110 1400 E type 150℃
Melting temperature ℃ 159 65 — — — DSC measurement
Softening point ℃ — 92 47 55 — R&B method
Refractive
index(D line)		 — 1.644 1.644 1.618 1.620 1.573 589nm

∗1 : Measured at the temperature of 170℃  ∗2 : Measured at the temperature of 25℃
∗The data shown in the table are for the purpose of reference only. Listed values are not intended to provide any guarantee for products.

Physical properties of cured samples

Product name OGSOL
PG		 OGSOL
PG-100		 OGSOL
EG		 OGSOL EG-210
(Newly developed product)		 (For reference)
Bis A epoxy		 Measurement
Method
Glass transition temperature ℃ > 230 173 115 125 148 DSC
5℃/min
Coefficient of thermal expansion ppm 96 101 117 124 112 TMA
10℃/min
Elastic modulus   MPa   — — 14 40 36 260℃
Softening point ℃ 260 251 > 260 267 > 250 TMA
10℃/min
Relative dielectric constant (εr) — 3.12 3.13 3.42 3.4 3.05 @1MHz
(Room Temperature)
Dielectric loss tangent (tanδ) — 0.015 0.017 0.023 0.024 0.017 @1MHz
(Room Temperature)
Water absorption wt% 0.21 0.22 0.16 0.2 0.17 Room temperature, 24H

● Curing condition : 100℃×1hr +150℃×1hr   ● Curing agent : Acid anhydride (Rikacid MH-700, MeHHPA)
∗The data shown in the table are for the purpose of reference only. Listed values are not intended to provide any guarantee for products.

Temperature dependence of soluble viscosity

Temperature dependence of soluble viscosity Image
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